1/5 www.asb.co.kr december 2008 plerow tm ALN5050 internally matched lna module specifications parameter unit min typ max frequency range mhz 4300 5800 gain db 16 17 gain flatness db 0.5 0.6 noise figure (nf) db 2.05 2.1 output ip3 (1) dbm 34 35 s11 / s22 (2) db -9 / -9 output p1db dbm 20 21 switching time (3) sec 0.65 supply current ma 160 180 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is -40 c to +85 c. 1) oip3 is measured with two tones at an output power of 4 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 3 rf in 8 rf out 10 +vcc others ground ? s 21 = 17.5 db @ 4300 mhz = 16.5 db @ 5800 mhz ? nf of 2.05 db over frequency ? unconditionally stable ? single 5v supply ? high oip3 @ low current the plerow tm aln-series is the compactly designed surface-mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite communi- cation terminals, catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. outline drawing (unit: mm) features specifications (in production) note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding considerations. 2. we recommend that the ground via holes be placed on the bottom of all ground pins fo r better rf and thermal performance, as shown in the drawing at the left side. description a ln5050 a sb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) typ. @ t = 25 c, v s = 5 v, freq. = 5050 mhz, z o.sys = 50 ohm website: www.asb.co.kr e-mail: sales@asb.co.kr tel: (82) 42-528-7223 fax: (82) 42-528-7222 asb inc., 4th fl. venture town bldg., 367-17 goijeong-dong, seo-gu, daejon 302-716, korea more information 2-stage single type
2/5 www.asb.co.kr december 2008 plerow tm ALN5050 internally matched lna module s-parameters oip3 p1db 4300~5800 +5 v s-parameters & k factor typical performance (measured) noise figure
3/5 www.asb.co.kr december 2008 plerow tm ALN5050 internally matched lna module switching time (@ 4300mhz) switching time (@ 5050mhz) switching time (@ 5800mhz)
4/5 www.asb.co.kr december 2008 plerow tm ALN5050 internally matched lna module 1. s-parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s-parameter 2. oip3, p1db & nf note: tested at v s = 5v. 4300 mhz 5050 mhz 5800 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 17.71 -12.65 -13.30 18.02 0.52 -12.06 -21.08 17.50 -12.71 -14.94 4.75 v 18.01 -12.70 -12.89 18.34 0.54 -12.40 -21.39 17.80 -12.52 -14.89 5.00 v 18.23 -12.78 -12.65 18.56 0.56 -12.76 -21.80 18.00 -12.87 -14.84 5.25 v 18.40 -12.85 -12.58 18.73 0.58 -12.05 -21.05 18.15 -12.46 -14.79 5.50 v 18.54 -12.88 -12.70 18.84 0.58 -12.25 -20.54 18.26 -12.62 -14.71 4300 mhz 5050 mhz 5800 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 35.56 22.14 - 34.21 21.91 - 32.53 22.11 - 4.75 v 36.65 22.54 - 35.81 22.50 - 34.02 22.75 - 5.00 v 37.80 22.88 - 37.22 22.92 - 35.95 23.25 - 5.25 v 38.33 23.23 - 37.99 23.27 - 36.47 23.73 - 5.50 v 38.83 23.52 - 38.21 23.54 - 35.65 24.02 - 4300 mhz 5050 mhz 5800 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) -45 c 19.51 -11.98 -11.70 20.49 0.98 -12.17 -21.27 19.83 -15.45 -19.86 -10 c 19.24 -12.01 -12.29 19.95 0.71 -12.33 -20.68 19.30 -14.57 -17.62 25 c 19.25 -12.50 -12.62 19.73 0.72 -12.61 -19.15 19.01 -12.19 -16.10 60 c 19.06 -12.90 -13.40 19.42 0.72 -12.51 -17.89 18.70 -11.97 -15.87 85 c 18.81 -13.23 -14.10 18.65 0.68 -12.81 -16.56 18.13 -10.12 -16.13 4300 mhz 5050 mhz 5800 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) -45 c 37.38 22.77 - 36.41 22.98 - 36.94 21.78 - -10 c 37.32 22.57 - 37.01 22.60 - 34.62 21.52 - 25 c 36.01 22.45 - 36.67 22.42 - 35.20 21.17 - 60 c 36.37 22.29 - 36.40 22.10 - 34.50 22.26 - 85 c 35.77 21.95 - 35.76 21.51 - 34.36 21.36 - rf performance with operating temperature rf performance with voltage change
5/5 www.asb.co.kr december 2008 plerow tm ALN5050 internally matched lna module 1) the tantal capacitor is optional and for bypa ssing the ac noise introduced from the dc supply. the capacitance value may be determined by customer?s dc supply status. 2) so-called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and bl ocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application frequency. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal capacitor v dc 20~40 sec 260 c 200 c 150 c 60~180 sec ramp-up (3 a c/sec) ramp-down (6 c/sec) size 25 x 25mm in out +vcc (for aln series ? 13x13mm)
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